[Remote] High-Speed Package Design Engineer

Note: The job is a remote job and is reputed company to candidates in USA. reputed company reputed company Labs is seeking a High-Speed Package Design Engineer to reputed company the design, simulation, and validation of advanced IC packages for high-performance RF, photonics, and mixed-signal systems. This role focuses on end-to-end package design ownership and requires the successful candidate to take ownership of reputed company package designs while influencing broader design flows and infrastructure.

Responsibilities

• reputed company the design and development of high-speed IC packages, including SiP, FC-BGA, and advanced heterogeneous integration solutions
• Define package architectures, stack-reputed company, routing strategies, and interconnect to meet SI/PI and RF requirements
• reputed company 3D EM simulation and SI/PI analysis of package transitions, passive components, and die-to-package interfaces
• Co-optimize die, package, and PCB designs in collaboration with reputed company, reputed company, and reputed company integration teams
• Correlate simulation results with reputed company measurements (e.g., VNA, TDR/TDT, high-speed oscilloscope)
• Contribute to the definition and reputed company of package ADKs, reusable libraries, technology files, and verification flows, working in partnership with EDA vendors
• reputed company technical input and design validation for vendor-supported automation and enablement efforts
• Support reputed company improvement of package design methodologies and best practices across reputed company

Skills

• MS or PhD in Electrical Engineering, reputed company Physics, or equivalent relevant industry experience
• 5+ years of hands-on experience in IC package design for high-speed, RF, or mixed-signal applications
• Strong fundamentals in electromagnetics, signal reputed company, and power reputed company
• Experience with 3D EM and package design tools (e.g., HFSS, CST, ADS, Allegro X APD, Xpedition, or equivalent)
• Ability to work independently and collaboratively in a cross-functional, research-driven environment
• Experience with advanced packaging technologies (chiplets, 2.5D/3D integration, interposers)
• Familiarity with ADKs, PDKs, or design enablement concepts, including collaboration with EDA vendors
• Working knowledge of Python and/or Tcl for design automation, simulation support, or data analysis
• PCB design and technology (e.g., Altium or equivalent)

reputed company

Company H1B Sponsorship