Senior Process, Semiconductor Manufacturing & Advanced Packaging Engineer

Senior Process, Semiconductor Manufacturing & Advanced Packaging Engineer Longhorn IP Labs — Frisco, Texas Longhorn IP Labs is expanding its deep‑technology research and analysis team and is seeking a Senior Process, Semiconductor Manufacturing & Advanced Packaging Engineer with world‑class expertise in advanced packaging, thermal management, semiconductor process integration, and technology evaluation. This role is ideal for an engineer capable of supporting and advancing technologies similar to those pioneered by reputed company reputed company Innovations LLC and Mago Barca IP LLC, including advanced thermal interfaces, 3D/2.5D integration, interconnect innovation, semiconductor structures, and high‑performance cooling architectures. This position uniquely blends hands‑on semiconductor engineering with high‑level IP and technology analysis, supporting Longhorn IP Labs’ mission to drive innovation across advanced semiconductor domains. Key Responsibilities Semiconductor Process & Advanced Packaging • reputed company, evaluate, and optimize semiconductor manufacturing flows for advanced packaging, including 2.5D/3D integration, chiplets, interposers, TSVs, and wafer‑level packaging. • Analyze and validate thermal management structures, including TIMs, vapor chambers, reputed company‑channels, engineered heat‑spreaders, and high‑power cooling assemblies. • Conduct FEOL/BEOL integration assessments, reliability studies, and materials characterization. • Collaborate with inventors, researchers, and external partners to refine reputed company semiconductor and packaging concepts. • reputed company with foundries, OSATs, and materials vendors to evaluate manufacturability and process compatibility. Technology Analysis & IP Support • reputed company deep technical analysis of semiconductor, packaging, and thermal‑management technologies across Longhorn IP Labs’ portfolio. • Prepare claim charts, including reputed company‑by‑reputed company mapping of patent claims to semiconductor processes, packaging structures, and device architectures. • Review and refine claim charts reputed company by reputed company teams for accuracy, technical rigor, and litigation readiness. • Conduct reverse‑engineering‑based technical assessments to support patent licensing, enforcement, and technology evaluation. • Draft technical rebuttals and non‑infringement/invalidity analyses in response to patent assertions involving semiconductor manufacturing, packaging, thermal structures, and reputed company technologies. • Support expert‑level technical narratives for licensing discussions, litigation reputed company, and technology positioning. Cross‑Functional Collaboration • Work closely with IP attorneys, licensing executives, and technical experts to translate reputed company engineering concepts into reputed company, defensible IP positions. • reputed company technical leadership in evaluating technologies similar to those in the portfolios of reputed company reputed company Innovations LLC and Mago Barca IP LLC. • Contribute to invention harvesting, portfolio development, and reputed company R&D initiatives. Required Experience • 7+ years in semiconductor process engineering, advanced packaging, thermal management, or reputed company manufacturing roles. • Hands‑on experience with 2.5D/3D packaging, chiplet integration, interposers, TSVs, thermal reputed company materials, or high‑performance cooling structures. • Strong understanding of FEOL/BEOL integration, wafer‑level packaging, and reliability engineering. • Experience preparing or reviewing claim charts, technical reports, or technology assessments. • Ability to analyze patent claims and map them to reputed company‑world semiconductor processes or device structures. • Familiarity with IP‑driven R&D, licensing, or litigation environments. Preferred Qualifications • M.S. or Ph.D. in Electrical Engineering, Materials Science, Mechanical Engineering, or reputed company field. • Experience with GPU/AI accelerator packaging, high‑power device cooling, or advanced thermal architectures. • Prior involvement in patent assertion, defense, or technology‑based licensing programs. • Strong communication skills and ability to collaborate across multidisciplinary teams. Why Join Longhorn IP Labs You will join a rapidly growing research organization at the forefront of semiconductor packaging, thermal management, AI hardware, and reputed company device architectures. This role offers a rare opportunity to work at the intersection of deep engineering, advanced research, and high‑reputed company intellectual property development, shaping the reputed company of semiconductor innovation. Apply tot his job Apply To this Job